The advantage of the immersion gold process is that the color deposited on the surface of the printed circuit is very stable, the brightness is good, the coating is very flat, and the solderability is very good.
Why we need immersion gold process?
The copper on the circuit board is mainly purple copper, and the copper soldering points are easily oxidized in air, which can cause poor conductivity, such as poor soldering or poor contact, and reduce the performance of the circuit board.
So it is necessary to perform surface treatment on the copper welding point. Gold deposition is the process of plating gold on top, which can effectively block copper metal and air to prevent oxidation. Therefore, gold deposition is a surface oxidation prevention treatment method, which involves covering the copper surface with a layer of gold through chemical reactions, also known as gold plating.
What are the benefits of using immersion gold circuit boards?
1) The immersion gold plate has bright colors, good color, and a beautiful appearance when sold.
2) The crystal structure formed by immersion gold is easier to weld than other surface treatments, and can have better performance to ensure quality.
3) Due to the presence of nickel gold only on the solder pads, the sinking gold plate will not affect the signal, as the signal transmission in the skin effect occurs in the copper layer.
4) Gold has relatively stable metallic properties, a denser crystal structure, and is less prone to oxidation reactions.
5) Due to the presence of nickel gold only on the solder pads of the immersion gold plate, the bonding between the solder mask and the copper layer on the circuit is more secure and less likely to cause micro short circuits.
6) The engineering compensation will not affect the spacing.
7) The stress of the sinking gold plate is easier to control.
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